This technology uses silica particles modified with organic functional groups, such as alkyl or mercapto groups, as templates. These are mixed with metal and subjected to low-temperature thermal reduction (400–1200°C) followed by acid etching. This allows for precise control over the structure (monolithic or composite) and morphology (spherical, hollow, or rattle-type) of the silicon carbide.
Conventional Acheson processes require ultra-high-temperature equipment exceeding 2000°C, leading to complex processes and high energy consumption. Furthermore, methods for producing hollow or rattle-type particles using external templates involve multiple steps and carry a risk of structural collapse.
This technology involves synthesizing silica particles with attached organic functional groups and independently controlling the type of functional group, thermal reduction time, and heat treatment conditions before and after metallothermic reduction. As a result, monolithic silicon carbide, silicon-carbon composites, and hollow or rattle-type particles can be efficiently obtained without separate templates. Applicable as volume-expansion buffering materials for silicon-based anodes and heat-resistant ceramic fillers, it enables the supply of customized SiC powders with engineered internal voids without the need for high-temperature facility investment.
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