This technology features a hybrid structure that replaces the interlayer dielectric of 3D vertical memory devices with a solid-state electrolyte-based secondary battery, enabling simultaneous information and energy storage within the same device volume.
In conventional 3D vertical memory, dielectric layers are essential to prevent interference between memory cells, but they serve no purpose other than protection. This results in inefficient use of space within the device.
This technology incorporates an a-Si anode and LiCoO2 cathode into the dielectric structure to provide solid-state battery functionality, combining it with vertical memory like ReRAM to utilize internal space for energy storage. It is ideal for power-constrained IoT sensor nodes, implantable medical devices, and ultra-compact wearable chips, enabling designs that handle both data retention and self-powering on a single chip without a separate battery.
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