This technology measures physical adhesion by cutting and peeling composite electrodes into multiple layers using a SAICAS micro-blade, while simultaneously performing continuous depth-profile analysis of binder distribution by applying X-ray Photoelectron Spectroscopy (XPS) to the exposed internal cross-sections.
Conventional electrode analysis techniques have been limited in their ability to precisely control and measure binder distribution and adhesion at various depths within an electrode. Consequently, it has been difficult to accurately evaluate the long-term reliability and physical stability of composite electrodes.
This technology is configured to measure adhesion in real-time by continuously cutting and peeling composite electrodes at specific depths of 1㎛ or more using a boron nitride micro-blade. It then quantifies binder distribution by irradiating the internal surface of each layer with X-rays to analyze the binding energy spectra and elemental percentages of the emitted photoelectrons. Applicable to the development of drying processes for thick, high-loading electrodes and the diagnosis of binder segregation defects, it allows for the simultaneous mechanical and chemical verification of binder migration phenomena in the thickness direction within a single sample.
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