Substrate gripping device.

Substrate gripping device that simultaneously operates multiple grippers using a pneumatic cylinder to hold the interior of a substrate

This technology is a mechanical mechanism that uses a pneumatic cylinder and piston rod to simultaneously move multiple grippers mounted on a body frame in a linear direction, physically gripping the internal space of a substrate from multiple directions.

Precise alignment during substrate transfer is difficult, the gripping area is limited, and there is a risk of physical damage to components during the gripping process.

This technology adopts a structure where grippers positioned on each side of the body frame move linearly in four directions (up, down, left, and right) via a drive unit (piston rod), flexibly accommodating and securing the substrate through rollers and elastic elements within the grippers. It can be applied to semiconductor and display transfer as well as manufacturing automation, increasing alignment accuracy by gripping the substrate from multiple directions and reducing the risk of damage.

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Key Features:

• A first grip unit positioned on the first side of the body frame to hold a first area of the substrate
• A second grip unit positioned on the second side of the body frame to hold a second area of the substrate
• A drive unit that moves the first and second grip units in opposite directions during the gripping process
• A gripper with an accommodation space for the substrate area and a guide to direct the movement of the gripper

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This invention was developed with support from the Ministry of Trade, Industry and Energy for the development of process technology, grippers, and assembly technology for the assembly of small, precision parts for mobile IT products.