Vacuum cooling system utilizing semiconductor waste heat energy

Water-based vacuum cooling system that recycles semiconductor waste heat as a vaporization heat source

This technology is a vacuum cooling system consisting of a cooling energy generation module that uses water as a working fluid to produce cooling steam through vaporization in a vacuum, a heat exchange module, a liquefaction/condensation module, a heat supply module that captures semiconductor waste heat, and a control module for integrated management.

Existing cooling methods for high-heat semiconductor facilities, such as AI data centers, have faced issues with high power consumption and environmental pollution caused by the use of refrigerants.

This technology proposes a circular structure that captures thermal energy generated from semiconductors to recycle it as a vaporization heat source, using only water as the working fluid, and integrates control of each module based on parameters such as vacuum pressure and target temperature. It can be applied to cooling AI data centers and semiconductor production facilities, implementing cooling using only waste heat without the need for separate refrigerants, thereby reducing both energy costs and carbon emissions.

‍

‍

Key Features:

• Cooling energy generation module that uses water as a working fluid and produces cooling steam through vaporization in a vacuum state
• Heat exchange module that receives cooling steam to generate cooling energy through heat exchange and releases it into the target cooling space
• Liquefaction/condensation module that condenses the cooling steam passing through the heat exchange module into condensate and resupplies it to the cooling energy generation module
• Heat supply module including a heat capture unit that collects thermal energy generated from semiconductors and a heat transfer unit that delivers it to the cooling energy generation module