This technology induces chemical covalent bonds, such as Si-O-C and Si-O-Si, between a polymer substrate and an inorganic thin-film layer by exposing the surface to 1–100 kGy of radiation. This process significantly improves interfacial adhesion.
Conventional polymer composite separators suffer from poor stability due to thermal shrinkage at high temperatures. Furthermore, weak bonding between the polymer substrate and the inorganic layer often leads to delamination, which can cause internal short circuits and battery explosions.
This technology involves treating a porous polymer substrate with oxygen plasma to impart hydrophilicity, depositing an inorganic thin film (e.g., SiO2, Al2O3), and then applying 1–100 kGy of radiation (e.g., electron beam) to strengthen the chemical bonds at the interface. Applicable to heat-resistant lithium-ion battery separators, high-safety EV cells, and water treatment membranes, it prevents inorganic layer delamination without adhesive binders, reducing the risk of internal short circuits.
This invention was developed with support from the Ministry of Science, ICT and Future Planning for the development of organic environmental pollutant-reducing photoelectrochemical hydrogen production.
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