This technology utilizes a novel polyimide, in which two or more organic radical groups are bonded to a diamine component, as an electrode active material. It achieves thermal stability through intra-chain reactions within the polymer and enables the implementation of flexible, film-type electrodes.
Conventional inorganic-based electrodes suffer from low flexibility, making them prone to cracking when bent. Even when organic radical polymers are used, they face limitations such as low heat resistance and difficulty in achieving sufficient electrode capacity.
This technology utilizes a specific polyimide structure with organic radical groups bonded to a pyrrolidine ring and its precursor, soluble poly(amic acid). By creating ultra-thin film electrodes through a solution process followed by thermal imidization, it simultaneously achieves heat resistance and high-density redox reactions. It can be applied to thin-film power sources for flexible displays, smart cards, and skin-attachable sensors, offering the potential to manufacture metal-free, bend-resistant organic electrodes via printing processes.
US9012076B2, WO2012-141532A9