This technology is a doping process that selectively diffuses only boron elements into silicon oxide by placing a dummy substrate coated with a boron compound dopant at a physical distance from silicon oxide powder and performing heat treatment, thereby leaving no boron compound impurities behind.
Silicon oxide-based active materials have historically suffered from low electrical conductivity and poor long-term cycle life. Conventional methods of directly mixing dopants with active materials often leave residual boron compound impurities, which limit the specific capacity of the active material.
By placing a substrate coated with a boron compound, such as borosilicate, at a distance from the silicon oxide powder and heat-treating them at 800–1000°C, this technology enables uniform doping of only boron elements via vapor-phase diffusion, while also inducing silicon crystallization. It can be applied to mass production lines for silicon-based anode materials for electric vehicles and high-capacity IT devices, allowing for the production of anode materials with improved ion diffusion rates and cycle characteristics without the need for a post-doping cleaning process.
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