This technology improves interfacial stability by mixing N,N,N,N-tetraethylsulfamide (NTESA) with cathode active materials and applying heat treatment to form an artificial Cathode-Electrolyte Interphase (CEI) layer functionalized with amine and sulfone groups on the cathode surface.
Due to their high nickel content, Ni-rich NCM cathode active materials generate Ni4+ species during charging, which accelerate electrolyte decomposition. This leads to increased interfacial resistance between the electrode and electrolyte, resulting in reduced cycle life.
This technology involves mixing the NTESA additive at 1.0–5.0 wt% relative to the cathode material and heat-treating it at 400°C to modify the surface. The resulting amine/sulfone-functionalized CEI layer scavenges HF and prevents direct contact with the electrolyte, thereby suppressing electrolyte decomposition and transition metal dissolution. It can be applied to the post-processing stage for manufacturers of high-nickel cathodes like NCM811, reducing conversion costs by simply adding a mixing step to existing firing equipment.
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