Sold
Available
IBL-26-0668

Lamination device equipped with a lifting mechanism

Listed on
2026-09-02
Lamination device for precision attachment using a position sensor-linked lifting mechanism

This technology relates to a lamination device equipped with a lifting mechanism. The invention comprises a turntable body featuring multiple receiving grooves on its upper surface, a turntable including multiple turn-stage jigs housed within these grooves, a position sensor placed adjacent to one of the turn-stage jigs to detect its position, and a lamination roll positioned near the sensor that performs lamination on the jig from the center of the turntable toward the edge.

Existing solutions in this field have faced structural and functional limitations that required improvement.

This technology is a lamination device with a lifting mechanism that can be applied to relevant industries to enhance performance and efficiency.

Key Features:
  • A turntable including a turntable body with multiple receiving grooves on its upper surface and multiple turn-stage jigs housed within those grooves
  • A position sensor placed adjacent to one of the turn-stage jigs to detect its position
  • A lamination roll that moves from the center of the turntable toward the edge to press and laminate film onto the jig
  • A lifting mechanism that raises or lowers the jig based on position information detected by the sensor, along with a control unit to manage it

This patent is owned by IP Bank. Upon purchasing the patent, you may receive support through commercialization programs, recommendations for technology transfer and commercialization funding guarantees, and additional points during evaluations for priority procurement of excellent inventions.

Unlisted Company
Original applicant: Millstone Co., Ltd.; Current owner: IP Bank
Document
Date of application:
2020-03-11
|
Patent registration number:
10-2183773
Industry
machinery
Technology
Electric & Electronics
Country
Korea
Family Patent

N/A

Price
24000000
Fixed price
Subscribe to our newsletter to receive the latest patent information faster than anyone else.
← Back to list