This technology relates to a superhydrophobic coating composition, its manufacturing method, a superhydrophobic coating layer formed thereby, and its formation method. Specifically, it is a conductive superhydrophobic coating composition technology with enhanced adhesion and durability.
Existing technologies needed to address the problem of hindering industrial application due to the formation of superhydrophobic surfaces using complex methods and expensive materials. To overcome this, the present technology proposes a composition comprising a binder that includes a base compound resin and a metal-organic coupling agent, a conductive filler, and a coating stabilizer.
Accordingly, this technology can improve the adhesion and durability of the superhydrophobic coating layer while maintaining thin and uniform coating formation. It has significant utility in the fields of advanced materials and chemistry.
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