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Multi-sensor of nano-floating structure and manufacturing method thereof

Listed on
2026-03-24
Improved sensitivity, shortened detection time, multiple sensors

This technology is about a multi-sensor with a nano-suspended structure and a method that can improve multiple sensing capabilities and sensitivity characteristics.

Electrochemical sensors are generally manufactured in the form of a lab-on-a-chip for the purpose of real-time chemical substance identification and disease diagnosis, and the existing nanostructure sensor in the form of a lab-on-a-chip has a fluid flow formed in a direction parallel to the semiconductor substrate of the sensor, takes a long time to react, and requires a lot of reaction time and There is a problem in that the reaction sensitivity is low because the absolute amount of target substance that reacts is limited. To solve this problem, we propose a multi-sensor with a nano-suspended structure that enables multiple detections simultaneously and reduces the detection time by connecting multiple unit sensors formed in block units through one S-shaped microfluidic channel.

This technology is a groundbreaking technology that physically captures the target material and secondarily chemically captures the target material with the receiving material, increasing the chance of reaction, improving sensitivity and shortening the detection time, and at the same time detecting even a very small amount of the target material.

Key Features:
  • Form one or more nano suspended structure channels between the source and drain arrays on the top of the silicon substrate
  • Fluid containing the target material passes in a vertical direction to the nano suspended structure channel within the unit sensor
  • Target material is captured by the receptor material fixed to the nano suspended structure channel
  • By attaching multiple receptor materials to each unit sensor, unit sensors can simultaneously detect the corresponding target material

This technology was developed through the support of the National Research Foundation of Korea's research project on next-generation low-power, high-speed interconnect circuit and convergence design for 3D IC SIP using silicon interposer and chip stacking techniques.

Pohang University of Science & Technology
Lee Jeong-su | Park Chan-oh | Kim Dong-hoon | Jin Bo
Document
출원일:
2016-08-16
|
특허등록번호:
10-1838966
Industry
semiconductors
healthcare•pharm
Technology
Optics•Sensor
Semiconductor
Country
Korea
Family Patent

N/A

Price
Disclosed upon request
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