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IBL-26-0066

Low-temperature packaging box providing a dual-wall Seokbinggo effect

Listed on
2026-08-18
Low-temperature packaging box with a Seokbinggo (ice storage) effect created by an air gap between inner and outer boxes

This technology is a low-temperature packaging box that provides a dual-wall Seokbinggo effect, consisting of an inner box that forms an air gap with an outer box via pillar walls, along with internal intake and exhaust vents.

When packaging and distributing refrigerated or frozen goods, the interior is prone to warming due to external temperatures, making it difficult to maintain low temperatures without additional refrigerants.

By utilizing an air gap between the inner and outer boxes and a cold air convection structure that ensures only cold air remains inside, this technology can be applied to low-temperature packaging to maintain temperatures through a Seokbinggo effect without the need for extra refrigerants.

Key Features:
  • An inner box with a sealed top and bottom, featuring pillar walls exposed at the corners of the inner side walls to form an air gap with the outer box and ventilation holes.
  • An outer box folded to the height of the inner box's pillar walls, wrapping around the inner box to create an air gap with its side walls.
  • An intake vent formed on one of the inner box's side walls to allow cold air from a refrigerator to flow into the interior.
  • An exhaust vent formed on the top panel of the inner box that creates a Seokbinggo effect by discharging warm air while retaining only cold air.

This patent is owned by IP Bank. Upon purchase, you may receive support through commercialization programs, recommendations for technology transfer and commercialization funding guarantees, and bonus points during evaluations for priority procurement of excellent inventions.

Independent Inventor
Original applicants: Bun-do Yoon, Seok-hoon Kim; Current owner: IP Bank
Document
Date of application:
2021-04-08
|
Patent registration number:
10-2264089
Industry
personal products
logistics
Technology
Mechanical engineering
Country
Korea
Family Patent

N/A

Price
Disclosed upon request
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